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Sercalo produces silicon precision micro parts based on Deep reactive ion etching. This technology achieves better precision and surface quality compared to traditional machining techniques such as milling or laser.

This technology achieves better precision and surface quality compared to traditional machining techniques such as milling or laser. Minimum feature size can be as low as 5 µm with an aspect ratio up to 50, i.e. parts can be made out of structures with 5 µm wide and 250 µm tall beams. Structure height is between 100 µm up to 400 µm.

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